Microelectronic Systems: Circuits, Systems and Applications by Albert Heuberger, Günter Elst, Randolf Hanke, Janina

By Albert Heuberger, Günter Elst, Randolf Hanke, Janina Heppner, Karlheinz Kirsch

This ebook is devoted to Prof. Dr. Heinz Gerhäuser at the party of his retirement either from the location of government Director of the Fraunhofer Institute for built-in Circuits IIS and from the Endowed Chair of knowledge applied sciences with a spotlight on communique Electronics (LIKE) on the Friedrich-Alexander-Universität Erlangen-Nürnberg. Heinz Gerhäusers imaginative and prescient and entrepreneurial spirit have made the Fraunhofer IIS probably the most profitable and popular German examine associations.

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Thermal gradients or temperature changes in the system may also have a large impact on the mechanical reliability of the system. Therefore, thermal management is very important for the design of entire 3-D systems. Figure 4 left depicts a half model of a TSV with ICV-SLID connection to the lower die as well as a transmission line on top. In the right part of the same figure the thermal influence of this TSV structure with a diameter of 10 m at the proximity of a power device is shown. The temperature of the hot spot is reduced Fig.

For industrial position and rotation sensors a low power, low area ADC with 12 Bit resolution @ 1 MS=s was developed. Since the final product should be miniaturized a high level of integration was needed. In the final ASIC two of the ADCs were integrated for a two channel sine-cosine measurement principle. The second part of the ASIC consists of the digital signal processing for a SIL-Level 2 approved data transmission. For the ADC the most critical requirements concerned power consumption and chip area (both as low as possible) and an extended ambient tem- Fig.

This can be achieved by exploiting stage scaling techniques, where switched capacitor (SC) circuits are determined by noise requirements in each stage. It has been proven that thermal noise contribution of a given stage is reduced by the gain of the previous stages, allowing the reduction of the capacitors size of that stage. Another technique is based on amplifier sharing between adjacent ADC stages working in opposite clock phases. This allows a theoretical reduction of half the number of amplifiers.

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